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C3 ChipZentronix

Chip Quik, Inc.

PA0006C

Solderless Breadboards

RoHS: Compliant

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Compliant

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Specifications

Paket
Bulk
Uzunluk
20.32 mm
Tip
SOIC-16 to DIP-16 SMT Adapter
Spacing
5.5 mm
RoHS
Details
Ürün Durumu
Active
Package Accepted
SOIC
Pitch
0.050 (1.27mm)
Genişlik
17.78 mm
Pozisyon Sayısı
16
Proto Board Type
SMD to DIP
Seri
Proto-Advantage
Material
FR4 Epoxy Glass
Contact Materials
Gold
Boyut / Ölçü
0.800 L x 0.700 W (20.32mm x 17.78mm)
Board Thickness
0.063 (1.60mm)
Temel Ürün No
PA0006
Yükseklik
1.6 mm

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