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C3 ChipZentronix

Chip Quik, Inc.

IPC0060C

Solderless Breadboards

In StockRoHS: Compliant

Shipping

Same-day dispatch from stock

Genuine parts

Verified sourcing

RoHS

Compliant

Support

Technical team support

Specifications

Spacing
1.2 mm
Package Accepted
DFN
Board Thickness
0.063 (1.60mm)
Tip
DFN-8 to DIP-8 SMT Adapter
Proto Board Type
SMD to DIP
Uzunluk
10.16 mm
Pozisyon Sayısı
8
Ürün Durumu
Active
Pitch
0.020 (0.50mm)
Material
FR4 Epoxy Glass
Genişlik
10.16 mm
Yükseklik
1.6 mm
Contact Materials
Gold
Seri
Proto-Advantage
Boyut / Ölçü
0.400 L x 0.400 W (10.16mm x 10.16mm)
Paket
Bulk
RoHS
Details

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