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WS991SNL500T4

Solder

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Specifications

Temel Ürün No
WS991
Çalışma Sıcaklığı
-55°C ~ 175°C
Shelf Life Start
Date of Manufacture
Melting Point
423°F (217°C)
Özellikler
Moisture Resistant, Non-Inductive, Pulse Withstanding
Contains Lead
No
Composition
Metal Foil
Tedarikçi Cihaz Paketi
SMD
Flux Type
Water Soluble
Maks. Oturma Yüksekliği
0.110 (2.79mm)
Size
500 g
Boyut / Ölçü
0.236 L x 0.126 W (5.99mm x 3.20mm)
Güç (Watt)
0.16W
Descriptionfunction
Synthetic Water-Soluble
Kılıf / Paket
2512 J-Lead
Form
Jar, 17.64 oz (500g)
Direnç
25.5 kOhms
Ürün Durumu
Active
Shelf Life
6 Months
Temperature Coefficient
±2ppm/°C
Process
Lead Free
Package Type
Jar
Tip
Solder Paste
Paket
Tape & Reel (TR)
Tolerans
±0.1%
Seri
SMR1D
Alloy
Sn96.5/Ag3.0/Cu0.5
Terminal Sayısı
2
Mesh Type
4

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