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C3 ChipZentronix
US-2010

Capital Advanced Technologies

US-2010

Breakout Boards

RoHS: Compliant

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Specifications

Montaj
Through Hole
Proto Board Type
Through Hole to SIP
Parça Durumu
Active
Fabrika Tedarik Süresi
3 Weeks
Board Thickness
0.031 0.79mm 1/32
RoHS Durumu
ROHS3 Compliant
Pozisyon Sayısı
10
Yayın Yılı
1999
Hole Diameter
914.4 μm
Thickness
787μm
Kılıf / Paket
SIP
Nem Hassasiyeti (MSL)
Not Applicable
Boyut / Ölçü
0.598Lx1.000W 12.70mmx25.40mm
Package Accepted
Non Specific
Seri
2000, UNI-SIP™
Kurşunsuz
Contains Lead
Material
FR4 Epoxy Glass

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