PEX8614-BA50BC

Specifications

Jesd30 Code

S-PBGA-B324

Package Style

GRID ARRAY, HEAT SINK/SLUG

Number Of Terminals

324

Temperature Grade

OTHER

Clock Frequencymax

100 MHz

REACH Uyumluluk Kodu

compliant

Uzunluk

19 mm

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Supply Voltagenom

1 V

Genişlik

19 mm

Operating Temperaturemin

-10 °C

Terminal Formu

BALL

Package Equivalence Code

BGA324,18X18,40

Seated Heightmax

1.9 mm

Upsucsperipheral Ics Type

BUS CONTROLLER, PCI

Package Code

HBGA

Tepe Reflow Süresi (maks. sn)

NOT SPECIFIED

Drive Interface Standard

IEEE 1149.1; IEEE 1149.6

Part Life Cycle Code

Obsolete

Package Body Material

PLASTIC/EPOXY

Supply Voltagemin

0.95 V

Data Transfer Ratemax

0.0125 MBps

HTS Kodu

8542.31.00.01

Supply Voltagemax

1.05 V

Bus Compatibility

I2C; PCI; SMBUS; SPI; USB

Terminal Adımı

1 mm

Operating Temperaturemax

85 °C

Terminal Pozisyonu

BOTTOM

Package Description

HBGA, BGA324,18X18,40

Package Shape

SQUARE

ECCN Kodu

3A991.A.2

Yüzey Montaj

YES

Ihs Manufacturer

BROADCOM INC