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Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Supply Voltagemin
- 1.4 V
- Package Code
- BGA
- Speed
- 533 MHz
- Qualification Status
- Not Qualified
- Package Body Material
- PLASTIC/EPOXY
- Pin Sayısı
- 783
- Package Shape
- SQUARE
- External Data Bus Width
- 64
- Integrated Cache
- YES
- Boundary Scan
- YES
- Address Bus Width
- 32
- Terminal Pozisyonu
- BOTTOM
- Jesd30 Code
- S-PBGA-B783
- REACH Uyumluluk Kodu
- compliant
- Rohs Code
- Yes
- Package Style
- GRID ARRAY
- Package Description
- BGA, BGA783,28X28,40
- Number Of Terminals
- 783
- Terminal Formu
- BALL
- Seated Heightmax
- 3.27 mm
- Part Life Cycle Code
- Obsolete
- Terminal Adımı
- 1 mm
- Bit Size
- 32
- Part Package Code
- BGA
- Yüzey Montaj
- YES
- Upsucsperipheral Ics Type
- MICROPROCESSOR, RISC
- Supply Voltagenom
- 1.5 V
- Uzunluk
- 29 mm
- Supply Voltagemax
- 1.6 V
- Format
- FIXED POINT
- Clock Frequencymax
- 666.66 MHz
- Low Power Mode
- YES
- Ihs Manufacturer
- APPLIED MICRO CIRCUITS CORP
- Package Equivalence Code
- BGA783,28X28,40
- Supply Currentmax
- 3000 mA
- ECCN Kodu
- 3A991.A.2
- Genişlik
- 29 mm
- HTS Kodu
- 8542.31.00.01
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED