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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Rohs Code
- Yes
- REACH Uyumluluk Kodu
- compliant
- Jesd30 Code
- S-PBGA-B316
- Address Bus Width
- 13
- Terminal Pozisyonu
- BOTTOM
- Boundary Scan
- YES
- Package Style
- GRID ARRAY
- Number Of Terminals
- 316
- Package Description
- BGA, BGA316,20X20,50
- Part Life Cycle Code
- Obsolete
- Seated Heightmax
- 2.65 mm
- Terminal Formu
- BALL
- Package Code
- BGA
- Supply Voltagemin
- 2.3 V
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Package Body Material
- PLASTIC/EPOXY
- Qualification Status
- Not Qualified
- Speed
- 266.66 MHz
- External Data Bus Width
- 32
- Integrated Cache
- YES
- Package Shape
- SQUARE
- Pin Sayısı
- 316
- Operating Temperaturemax
- 85 °C
- Ihs Manufacturer
- APPLIED MICRO CIRCUITS CORP
- Low Power Mode
- YES
- Operating Temperaturemin
- -40 °C
- Package Equivalence Code
- BGA316,20X20,50
- Additional Feature
- ALSO REQUIRES 3.3V SUPPLY
- HTS Kodu
- 8542.31.00.01
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Genişlik
- 27 mm
- ECCN Kodu
- 3A991.A.2
- Bit Size
- 32
- Terminal Adımı
- 1.27 mm
- Part Package Code
- BGA
- Temperature Grade
- INDUSTRIAL
- Supply Voltagenom
- 2.5 V
- Yüzey Montaj
- YES
- Upsucsperipheral Ics Type
- MICROPROCESSOR, RISC
- Format
- FIXED POINT