LTP5900IPC-WHMA1B2#PBF

Specifications

Current Receiving

4.5mA

Current Transmitting

5.4mA ~ 9.7mA

Contact Material Post

Copper Alloy

Interface

SPI, UART

Özellikler

Open Frame

Paket

Box

Fabrika Paket Adedi

1

Contact Finish Thickness Mating

30.0µin (0.76µm)

Frekans

2.4 GHz to 2.484 GHz

Nem Hassasiyeti (MSL)

1 (Unlimited)

Contact Finish Thickness Post

30.0µin (0.76µm)

Maks. Çalışma Sıcaklığı

+ 85 C

Kılıf / Paket

22-DIP Module

Pitch Mating

0.100 (2.54mm)

Seri

Dust Networks®, SmartMesh®, WirelessHART

Termination Post Length

0.093 (2.36mm)

Ürün Tipi

Networking Modules

Rf Familystandard

802.15.4

Pitch Post

0.100 (2.54mm)

Material Flammability Rating

UL94 V-0

Tip

PGA, ZIF (ZIP)

Housing Material

Liquid Crystal Polymer (LCP)

Besleme Gerilimi

2.75V ~ 3.76V

Processor Type

ARM Cortex M3

Protocol

WirelessHART

Temel Ürün No

LTP5900

Temel Parça No

LTP5900

Montaj Tipi

Through Hole

Supply Voltagemin

2.75 V

Ürün Durumu

Active

Contact Material Mating

Copper Alloy

Contact Finish Mating

Gold

Terminal

Solder

Çalışma Sıcaklığı

-40°C~85°C

Contact Finish Post

Gold

RoHS Durumu

ROHS3 Compliant

Ambalaj

Tray

Number Of Positions Or Pins Grid

370 (19 x 19)

Modulation

DSSS

Fabrika Tedarik Süresi

16 Weeks