ADG732BCP

Specifications

Risk Rank

5.36

Terminal Formu

NO LEAD

Temel Ürün No

ADG732

Part Life Cycle Code

Active

Moisture Sensitivity Levels

3

Yüzey Montaj

YES

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Additional Feature

ALSO OPERTES WITH 1.8V TO 5.5V SINGLE SUPPLY

Kılıf / Paket

48-WFQFN Exposed Pad, CSP

Package Body Material

UNSPECIFIED

Fonksiyon Sayısı

1

Paket

Bag

Pin Sayısı

48

Supply Voltagemax Vsup

2.75 V

Neg Supply Voltagenom Vsup

-2.5 V

Qualification Status

COMMERCIAL

Neg Supply Voltagemax Vsup

-2.75 V

Operating Temperaturemax

85 °C

Genişlik

7 mm

Temperature Grade

INDUSTRIAL

Switchon Timemax

37 ns

Montaj Tipi

Surface Mount

Number Of Channels

32

Uzunluk

7 mm

Switchoff Timemax

26 ns

JESD-609 Kodu

e0

Jesd30 Code

S-XQCC-N48

Supply Voltagenom Vsup

2.5 V

Package Description

HVQCCN,

Tedarikçi Cihaz Paketi

48-LFCSP (7x7)

Ürün Durumu

Obsolete

Package Code

HVQCCN

Onstate Resistance Matchnom

0.3 Ω

Terminal Kaplaması

TIN LEAD

Tepe Reflow Sıcaklığı (°C)

240

Neg Supply Voltagemin Vsup

-2.25 V

Onstate Resistancemax Ron

5.5 Ω

Kurşunsuz Kodu

No

Technology

CMOS

Terminal Adımı

0.5 mm