ADG507ATQ883B

Specifications

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Screening Level

MIL-STD-883 Class B

Terminal Pozisyonu

DUAL

Package Body Material

CERAMIC, GLASS-SEALED

Seated Heightmax

5.59 mm

Supply Voltagenom Vsup

15 V

Terminal Formu

THROUGH-HOLE

Number Of Terminals

28

REACH Uyumluluk Kodu

unknown

Reflow Temperaturemax S

NOT SPECIFIED

Qualification Status

MILITARY

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Package Shape

RECTANGULAR

JESD-609 Kodu

e0

Switchon Timemax

300 ns

Neg Supply Voltagenom Vsup

-15 V

Yüzey Montaj

NO

Genişlik

15.24 mm

Rohs Code

No

Number Of Channels

8

Offstate Isolationnom

68 dB

Jesd30 Code

R-GDIP-T28

Kurşunsuz Kodu

No

Package Style

IN-LINE

Part Life Cycle Code

Active

Risk Rank

5.05

Supply Voltagemax Vsup

16.5 V

Switchoff Timemax

300 ns

Terminal Kaplaması

TIN LEAD

Fonksiyon Sayısı

1

Neg Supply Voltagemax Vsup

-16.5 V

Part Package Code

DIP

Pin Sayısı

28

Package Description

CERAMIC, DIP-28

Technology

CMOS

Terminal Adımı

2.54 mm

Operating Temperaturemax

125 °C

Usage Level

Military grade

Onstate Resistancemax Ron

450 Ω

Temperature Grade

MILITARY