BLF881

Specifications

Case Connection

SOURCE

ECCN Kodu

EAR99

Configuration

SINGLE

Package Shape

RECTANGULAR

Package Description

ROHS COMPLIANT, CERAMIC PACKAGE-2

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Additional Feature

HIGH RELIABILITY

Highest Frequency Band

ULTRA HIGH FREQUENCY BAND

Transistor Element Material

SILICON

Number Of Terminals

2

Ihs Manufacturer

AMPLEON NETHERLANDS B V

Ds Breakdown Voltagemin

104 V

Package Style

FLANGE MOUNT

Jesd30 Code

R-CDFM-F2

Operating Mode

ENHANCEMENT MODE

Yüzey Montaj

YES

REACH Uyumluluk Kodu

unknown

Part Life Cycle Code

Contact Manufacturer

Exterior Housing Material

1

Polaritychannel Type

N-CHANNEL

Tepe Reflow Süresi (maks. sn)

NOT SPECIFIED

Terminal Formu

FLAT

Transistor Application

AMPLIFIER

Terminal Pozisyonu

DUAL

Fet Technology

METAL-OXIDE SEMICONDUCTOR

Qualification Status

Not Qualified