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C3 ChipZentronix
10078239-10002LF

Amphenol ICC (FCI)

10078239-10002LF

Inline Memory Module Sockets

RoHS: Compliant

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Specifications

Montaj Tipi
Through Hole
Maks. Çalışma Sıcaklığı
85°C
Min. Çalışma Sıcaklığı
-55°C
Number Of Contacts
240
Terminal
Through Hole
Contact Plating
Gold
Contact Finish Thickness
15.0μin 0.38μm
Contact Finish
Gold
Radyasyon Dayanımı
No
Mounting Feature
Normal, Standard - Top
Parça Durumu
Active
RoHS Durumu
RoHS Compliant
Housing Material
Thermoplastic
Contact Resistance
10mOhm
Pozisyon Sayısı
240
Ambalaj
Tray
Connector Style
DIMM
Length Tail
2.67mm
Pitch
2mm
Orientation
Straight
Akım Değeri
750mA
Yayın Yılı
2009
Voltage Rated Ac
30V
Insulation Materials
Resin
Standards
MO-269
Montaj
Through Hole
Memory Types
DDR3 SDRAM
Sıra Sayısı
2
Depth
7.6mm
Uzunluk
147mm
Özellikler
Board Lock, Latches
Voltage Rated Dc
30V
Yükseklik
20.55mm
Nem Hassasiyeti (MSL)
1 (Unlimited)
Insulation Resistance
1MOhm
Fabrika Tedarik Süresi
11 Weeks

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