XQ7Z030-1RF900Q

Specifications

Package Description

31 X 31 MM, 1 MM PITCH, BGA-900

Number Of Terminals

900

Yüzey Montaj

YES

Uzunluk

31 mm

Terminal Kaplaması

TIN LEAD

Terminal Pozisyonu

BOTTOM

Genişlik

31 mm

Qualification Status

Not Qualified

REACH Uyumluluk Kodu

not_compliant

Terminal Adımı

1 mm

Operating Temperaturemin

-40 °C

Package Code

BGA

Jesd30 Code

S-PBGA-B900

Rohs Code

No

Part Life Cycle Code

Transferred

Temperature Grade

AUTOMOTIVE

Ihs Manufacturer

XILINX INC

Package Body Material

PLASTIC/EPOXY

Seated Heightmax

3.44 mm

Terminal Formu

BALL

Package Equivalence Code

BGA900,30X30,40

Package Style

GRID ARRAY

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Package Shape

SQUARE

HTS Kodu

8542.31.00.01

JESD-609 Kodu

e0

Operating Temperaturemax

125 °C