XCZU9CG-L1SBVA484I

Specifications

Terminal Adımı

0.8 mm

Package Style

GRID ARRAY, FINE PITCH

REACH Uyumluluk Kodu

unknown

Supply Voltagemin

0.698 V

JESD-609 Kodu

e1

Terminal Pozisyonu

BOTTOM

Rohs Code

Yes

Supply Voltagenom

0.72 V

Additional Feature

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

Package Body Material

PLASTIC/EPOXY

Number Of Terminals

484

Ihs Manufacturer

XILINX INC

Uzunluk

19 mm

Package Equivalence Code

BGA484,22X22,32

Operating Temperaturemin

-40 °C

Package Code

FBGA

Seated Heightmax

2.61 mm

Tepe Reflow Sıcaklığı (°C)

250

Operating Temperaturemax

100 °C

Tepe Reflow Süresi (maks. sn)

30

Part Life Cycle Code

Transferred

Terminal Kaplaması

TIN SILVER COPPER

Package Description

FBGA, BGA484,22X22,32

HTS Kodu

8542.31.00.01

Terminal Formu

BALL

Yüzey Montaj

YES

Package Shape

SQUARE

Jesd30 Code

S-PBGA-B484

Genişlik

19 mm

Temperature Grade

INDUSTRIAL

Bus Compatibility

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

Supply Voltagemax

0.742 V

Moisture Sensitivity Levels

4

Upsucsperipheral Ics Type

PROGRAMMABLE SoC