XCZU9CG-L1FBVB900I

Specifications

Package Description

BGA, BGA900,30X30,40

Terminal Kaplaması

TIN SILVER COPPER

Part Life Cycle Code

Transferred

Tepe Reflow Sıcaklığı (°C)

245

Operating Temperaturemax

100 °C

Tepe Reflow Süresi (maks. sn)

30

Terminal Formu

BALL

HTS Kodu

8542.31.00.01

Genişlik

31 mm

Jesd30 Code

S-PBGA-B900

Yüzey Montaj

YES

Package Shape

SQUARE

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Moisture Sensitivity Levels

4

Supply Voltagemax

0.742 V

Temperature Grade

INDUSTRIAL

Bus Compatibility

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

Rohs Code

Yes

Supply Voltagenom

0.72 V

Supply Voltagemin

0.698 V

Terminal Pozisyonu

BOTTOM

JESD-609 Kodu

e1

Terminal Adımı

1 mm

Package Style

GRID ARRAY

REACH Uyumluluk Kodu

unknown

Package Body Material

PLASTIC/EPOXY

Additional Feature

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

Ihs Manufacturer

XILINX INC

Number Of Terminals

900

Operating Temperaturemin

-40 °C

Seated Heightmax

2.88 mm

Package Code

BGA

Package Equivalence Code

BGA900,30X30,40

Uzunluk

31 mm