XCZU9CG-2SFVC784I

Specifications

Yüzey Montaj

YES

Package Shape

SQUARE

Jesd30 Code

S-PBGA-B784

Genişlik

23 mm

Bus Compatibility

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

Temperature Grade

INDUSTRIAL

Supply Voltagemax

0.876 V

Moisture Sensitivity Levels

4

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Operating Temperaturemax

100 °C

Tepe Reflow Süresi (maks. sn)

30

Tepe Reflow Sıcaklığı (°C)

250

Terminal Kaplaması

TIN SILVER COPPER

Part Life Cycle Code

Transferred

Package Description

FBGA, BGA78428X28,32

HTS Kodu

8542.31.00.01

Terminal Formu

BALL

Number Of Terminals

784

Ihs Manufacturer

XILINX INC

Uzunluk

23 mm

Package Equivalence Code

BGA78428X28,32

Package Code

FBGA

Seated Heightmax

3.32 mm

Operating Temperaturemin

-40 °C

REACH Uyumluluk Kodu

unknown

Package Style

GRID ARRAY, FINE PITCH

Terminal Adımı

0.8 mm

JESD-609 Kodu

e1

Terminal Pozisyonu

BOTTOM

Supply Voltagemin

0.825 V

Supply Voltagenom

0.85 V

Rohs Code

Yes

Package Body Material

PLASTIC/EPOXY