XCZU9CG-2SFVC784E

Specifications

Tepe Reflow Sıcaklığı (°C)

250

Tepe Reflow Süresi (maks. sn)

30

Operating Temperaturemax

100 °C

Part Life Cycle Code

Transferred

Terminal Kaplaması

TIN SILVER COPPER

Package Description

FBGA, BGA78428X28,32

HTS Kodu

8542.31.00.01

Terminal Formu

BALL

Package Shape

SQUARE

Yüzey Montaj

YES

Jesd30 Code

S-PBGA-B784

Genişlik

23 mm

Temperature Grade

OTHER

Bus Compatibility

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

Supply Voltagemax

0.876 V

Moisture Sensitivity Levels

4

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Terminal Adımı

0.8 mm

Package Style

GRID ARRAY, FINE PITCH

REACH Uyumluluk Kodu

unknown

Supply Voltagemin

0.825 V

JESD-609 Kodu

e1

Terminal Pozisyonu

BOTTOM

Rohs Code

Yes

Supply Voltagenom

0.85 V

Package Body Material

PLASTIC/EPOXY

Number Of Terminals

784

Ihs Manufacturer

XILINX INC

Uzunluk

23 mm

Package Equivalence Code

BGA78428X28,32

Package Code

FBGA

Seated Heightmax

3.32 mm