XCZU9CG-2SFVA625I

Specifications

Number Of Terminals

625

Ihs Manufacturer

XILINX INC

Uzunluk

21 mm

Operating Temperaturemin

-40 °C

Package Code

FBGA

Seated Heightmax

3.43 mm

Package Equivalence Code

BGA625,25X25,32

Terminal Adımı

0.8 mm

Package Style

GRID ARRAY, FINE PITCH

REACH Uyumluluk Kodu

unknown

Rohs Code

Yes

Supply Voltagenom

0.85 V

Supply Voltagemin

0.825 V

JESD-609 Kodu

e1

Terminal Pozisyonu

BOTTOM

Package Body Material

PLASTIC/EPOXY

Yüzey Montaj

YES

Package Shape

SQUARE

Genişlik

21 mm

Jesd30 Code

S-PBGA-B625

Supply Voltagemax

0.876 V

Temperature Grade

INDUSTRIAL

Bus Compatibility

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Moisture Sensitivity Levels

4

Terminal Kaplaması

TIN SILVER COPPER

Part Life Cycle Code

Transferred

Tepe Reflow Sıcaklığı (°C)

250

Tepe Reflow Süresi (maks. sn)

30

Operating Temperaturemax

100 °C

Package Description

FBGA, BGA625,25X25,32

HTS Kodu

8542.31.00.01

Terminal Formu

BALL