XCZU7EG-3FFVC1156I

Specifications

Package Description

BGA,

Part Life Cycle Code

Transferred

Terminal Kaplaması

TIN SILVER COPPER

Tepe Reflow Sıcaklığı (°C)

245

Operating Temperaturemax

100 °C

Tepe Reflow Süresi (maks. sn)

30

Terminal Formu

BALL

HTS Kodu

8542.31.00.01

Genişlik

35 mm

Jesd30 Code

S-PBGA-B1156

Yüzey Montaj

YES

Package Shape

SQUARE

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Moisture Sensitivity Levels

4

Temperature Grade

INDUSTRIAL

Rohs Code

Yes

Supply Voltagenom

0.9 V

JESD-609 Kodu

e1

Terminal Pozisyonu

BOTTOM

Terminal Adımı

1 mm

REACH Uyumluluk Kodu

compliant

Package Style

GRID ARRAY

Package Body Material

PLASTIC/EPOXY

Ihs Manufacturer

XILINX INC

Date Of Intro

2017-02-15

Number Of Terminals

1156

Operating Temperaturemin

-40 °C

Package Code

BGA

Seated Heightmax

3.51 mm

Uzunluk

35 mm