XCZU6CG-1SFVA625I

Specifications

Package Equivalence Code

BGA625,25X25,32

Package Code

FBGA

Seated Heightmax

3.43 mm

Operating Temperaturemin

-40 °C

Uzunluk

21 mm

Ihs Manufacturer

XILINX INC

Number Of Terminals

625

Package Body Material

PLASTIC/EPOXY

JESD-609 Kodu

e1

Terminal Pozisyonu

BOTTOM

Supply Voltagemin

0.825 V

Supply Voltagenom

0.85 V

Rohs Code

Yes

Terminal Adımı

0.8 mm

REACH Uyumluluk Kodu

unknown

Package Style

GRID ARRAY, FINE PITCH

Moisture Sensitivity Levels

4

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Bus Compatibility

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

Temperature Grade

INDUSTRIAL

Supply Voltagemax

0.876 V

Jesd30 Code

S-PBGA-B625

Genişlik

21 mm

Package Shape

SQUARE

Yüzey Montaj

YES

Terminal Formu

BALL

HTS Kodu

8542.31.00.01

Package Description

FBGA, BGA625,25X25,32

Tepe Reflow Süresi (maks. sn)

30

Operating Temperaturemax

100 °C

Tepe Reflow Sıcaklığı (°C)

250

Part Life Cycle Code

Transferred

Terminal Kaplaması

TIN SILVER COPPER