XCZU4EG-3SFVC784I

Specifications

Date Of Intro

2017-02-15

Terminal Adımı

0.8 mm

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Number Of Terminals

784

Tepe Reflow Süresi (maks. sn)

30

HTS Kodu

8542.31.00.01

Terminal Pozisyonu

BOTTOM

Temperature Grade

INDUSTRIAL

Package Style

GRID ARRAY, FINE PITCH

Moisture Sensitivity Levels

4

Operating Temperaturemin

-40 °C

Package Code

FBGA

Seated Heightmax

3.32 mm

Terminal Kaplaması

TIN SILVER COPPER

Genişlik

23 mm

REACH Uyumluluk Kodu

compliant

Part Life Cycle Code

Transferred

Terminal Formu

BALL

Rohs Code

Yes

Operating Temperaturemax

100 °C

JESD-609 Kodu

e1

Yüzey Montaj

YES

Supply Voltagenom

0.9 V

Uzunluk

23 mm

Tepe Reflow Sıcaklığı (°C)

250

Package Body Material

PLASTIC/EPOXY

Package Shape

SQUARE

Package Description

FBGA,

Jesd30 Code

S-PBGA-B784

Ihs Manufacturer

XILINX INC