XCZU19EG-3FFVD1760I

Specifications

Supply Voltagenom

0.9 V

Rohs Code

Yes

JESD-609 Kodu

e1

Terminal Pozisyonu

BOTTOM

Terminal Adımı

1 mm

REACH Uyumluluk Kodu

compliant

Package Style

GRID ARRAY

Package Body Material

PLASTIC/EPOXY

Ihs Manufacturer

XILINX INC

Date Of Intro

2017-02-15

Number Of Terminals

1760

Package Code

BGA

Seated Heightmax

3.71 mm

Operating Temperaturemin

-40 °C

Uzunluk

42.5 mm

Package Description

BGA,

Part Life Cycle Code

Transferred

Terminal Kaplaması

TIN SILVER COPPER

Tepe Reflow Süresi (maks. sn)

30

Operating Temperaturemax

100 °C

Tepe Reflow Sıcaklığı (°C)

245

Terminal Formu

BALL

HTS Kodu

8542.31.00.01

Genişlik

42.5 mm

Jesd30 Code

S-PBGA-B1760

Yüzey Montaj

YES

Package Shape

SQUARE

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Moisture Sensitivity Levels

4

Temperature Grade

INDUSTRIAL