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C3 ChipZentronix

AMD Xilinx

XCZU11EG-3FFVC1156I

Application Specific Microcontrollers

RoHS: Compliant

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Specifications

Package Body Material
PLASTIC/EPOXY
Terminal Adımı
1 mm
REACH Uyumluluk Kodu
compliant
Package Style
GRID ARRAY
Supply Voltagenom
0.9 V
Rohs Code
Yes
Terminal Pozisyonu
BOTTOM
JESD-609 Kodu
e1
Uzunluk
35 mm
Seated Heightmax
3.51 mm
Package Code
BGA
Operating Temperaturemin
-40 °C
Date Of Intro
2017-02-15
Number Of Terminals
1156
Ihs Manufacturer
XILINX INC
HTS Kodu
8542.31.00.01
Terminal Formu
BALL
Part Life Cycle Code
Transferred
Terminal Kaplaması
TIN SILVER COPPER
Tepe Reflow Süresi (maks. sn)
30
Operating Temperaturemax
100 °C
Tepe Reflow Sıcaklığı (°C)
245
Package Description
BGA,
Temperature Grade
INDUSTRIAL
Upsucsperipheral Ics Type
PROGRAMMABLE SoC
Moisture Sensitivity Levels
4
Package Shape
SQUARE
Yüzey Montaj
YES
Genişlik
35 mm
Jesd30 Code
S-PBGA-B1156

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