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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Terminal Formu
- BALL
- REACH Uyumluluk Kodu
- compliant
- Package Description
- LBGA,
- Package Style
- GRID ARRAY, LOW PROFILE
- Package Body Material
- PLASTIC/EPOXY
- Output Function
- MACROCELL
- Ihs Manufacturer
- XILINX INC
- Yüzey Montaj
- YES
- Tepe Reflow Sıcaklığı (°C)
- 260
- Seated Heightmax
- 1.4 mm
- Pin Sayısı
- 352
- JESD-609 Kodu
- e1
- Temperature Grade
- COMMERCIAL
- Organization
- 0 DEDICATED INPUTS, 166 I/O
- Terminal Pozisyonu
- BOTTOM
- Number Of Terminals
- 352
- Tepe Reflow Süresi (maks. sn)
- 30
- Package Equivalence Code
- BGA352,26X26,50
- Supply Voltagenom
- 5 V
- Uzunluk
- 35 mm
- Moisture Sensitivity Levels
- 3
- Part Package Code
- BGA
- Programmable Logic Type
- FLASH PLD
- Number Of Io Lines
- 166
- Genişlik
- 35 mm
- Clock Frequencymax
- 55.6 MHz
- HTS Kodu
- 8542.39.00.01
- Terminal Kaplaması
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Package Code
- LBGA
- Supply Voltagemax
- 5.25 V
- Part Life Cycle Code
- Obsolete
- Additional Feature
- 216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
- Operating Temperaturemax
- 70 °C
- Rohs Code
- Yes
- Package Shape
- SQUARE
- Terminal Adımı
- 1.27 mm
- Supply Voltagemin
- 4.75 V
- Propagation Delay
- 15 ns
- Jesd30 Code
- S-PBGA-B352
- Qualification Status
- Not Qualified