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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Terminal Formu
- BALL
- REACH Uyumluluk Kodu
- compliant
- Package Description
- TFBGA, BGA144,13X13,32
- Package Style
- GRID ARRAY, THIN PROFILE, FINE PITCH
- Output Function
- MACROCELL
- Package Body Material
- PLASTIC/EPOXY
- Ihs Manufacturer
- XILINX INC
- Yüzey Montaj
- YES
- Tepe Reflow Sıcaklığı (°C)
- 260
- Seated Heightmax
- 1.2 mm
- Pin Sayısı
- 144
- JESD-609 Kodu
- e1
- Temperature Grade
- COMMERCIAL
- Organization
- 0 DEDICATED INPUTS, 117 I/O
- Number Of Terminals
- 144
- Terminal Pozisyonu
- BOTTOM
- Package Equivalence Code
- BGA144,13X13,32
- Tepe Reflow Süresi (maks. sn)
- 30
- Uzunluk
- 12 mm
- Supply Voltagenom
- 2.5 V
- Moisture Sensitivity Levels
- 3
- Part Package Code
- BGA
- Programmable Logic Type
- FLASH PLD
- Number Of Io Lines
- 117
- Genişlik
- 12 mm
- Clock Frequencymax
- 222.2 MHz
- Insystem Programmable
- YES
- HTS Kodu
- 8542.39.00.01
- Terminal Kaplaması
- TIN SILVER COPPER
- Package Code
- TFBGA
- Supply Voltagemax
- 2.62 V
- Part Life Cycle Code
- Obsolete
- Number Of Macro Cells
- 144
- Jtag Bst
- YES
- Additional Feature
- YES
- Operating Temperaturemax
- 70 °C
- Rohs Code
- Yes
- Package Shape
- SQUARE
- Supply Voltagemin
- 2.37 V
- Terminal Adımı
- 0.8 mm