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C3 ChipZentronix

AMD Xilinx

XC1718L-DD8I

Memory Modules

RoHS: Compliant

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RoHS

Compliant

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Specifications

Package Equivalence Code
DIP8,.3
Package Description
DIP, DIP8,.3
HTS Kodu
8542.32.00.71
Part Life Cycle Code
Obsolete
Jesd30 Code
R-XDIP-T8
Number Of Terminals
8
Rohs Code
No
Qualification Status
Not Qualified
Clock Frequencymax Fclk
2.5 MHz
Memory Ic Type
CONFIGURATION MEMORY
Terminal Formu
THROUGH-HOLE
Ihs Manufacturer
XILINX INC
Temperature Grade
INDUSTRIAL
Output Characteristics
3-STATE
Organization
18144X1
Package Shape
RECTANGULAR
ECCN Kodu
EAR99
Operating Temperaturemax
85 °C
Package Code
DIP
Memory Width
1
Number Of Words
18144 words
Io Type
COMMON
Supply Voltagenom Vsup
3.3 V
Package Style
IN-LINE
Operating Temperaturemin
-40 °C
Terminal Pozisyonu
DUAL
Standby Currentmax
0.0015 A
REACH Uyumluluk Kodu
unknown
Supply Currentmax
0.005 mA
Yüzey Montaj
NO
Terminal Adımı
2.54 mm
Number Of Words Code
18144
Package Body Material
CERAMIC

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