XCZU9CG-2SFVA625E

Specifications

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Number Of Terminals

625

Package Equivalence Code

BGA625,25X25,32

Seated Heightmax

3.43 mm

Package Code

FBGA

Uzunluk

21 mm

Supply Voltagemin

0.825 V

JESD-609 Kodu

e1

Terminal Pozisyonu

BOTTOM

Rohs Code

Yes

Supply Voltagenom

0.85 V

REACH Uyumluluk Kodu

compliant

Package Style

GRID ARRAY, FINE PITCH

Terminal Adımı

0.8 mm

Package Body Material

PLASTIC/EPOXY

Jesd30 Code

S-PBGA-B625

Genişlik

21 mm

Package Shape

SQUARE

Yüzey Montaj

YES

Moisture Sensitivity Levels

4

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Temperature Grade

OTHER

Bus Compatibility

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

Supply Voltagemax

0.876 V

Package Description

BGA-625

Tepe Reflow Sıcaklığı (°C)

250

Tepe Reflow Süresi (maks. sn)

30

Operating Temperaturemax

100 °C

Terminal Kaplaması

TIN SILVER COPPER

Part Life Cycle Code

Active

Terminal Formu

BALL

HTS Kodu

8542.31.00.01