XCZU9CG-2FBVB900I

Specifications

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Number Of Terminals

900

Seated Heightmax

2.88 mm

Package Code

BGA

Operating Temperaturemin

-40 °C

Package Equivalence Code

BGA900,30X30,40

Uzunluk

31 mm

Supply Voltagenom

0.85 V

Rohs Code

Yes

JESD-609 Kodu

e1

Terminal Pozisyonu

BOTTOM

Supply Voltagemin

0.825 V

Package Style

GRID ARRAY

REACH Uyumluluk Kodu

compliant

Terminal Adımı

1 mm

Package Body Material

PLASTIC/EPOXY

Genişlik

31 mm

Jesd30 Code

S-PBGA-B900

Yüzey Montaj

YES

Package Shape

SQUARE

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Moisture Sensitivity Levels

4

Supply Voltagemax

0.876 V

Bus Compatibility

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

Temperature Grade

INDUSTRIAL

Package Description

BGA-900

Part Life Cycle Code

Active

Terminal Kaplaması

TIN SILVER COPPER

Tepe Reflow Süresi (maks. sn)

30

Operating Temperaturemax

100 °C

Tepe Reflow Sıcaklığı (°C)

245

Terminal Formu

BALL