XCZU9CG-1FBVB900I

Specifications

Supply Voltagemax

0.876 V

Temperature Grade

INDUSTRIAL

Bus Compatibility

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Moisture Sensitivity Levels

4

Yüzey Montaj

YES

Package Shape

SQUARE

Genişlik

31 mm

Jesd30 Code

S-PBGA-B900

HTS Kodu

8542.31.00.01

Terminal Formu

BALL

Terminal Kaplaması

TIN SILVER COPPER

Part Life Cycle Code

Active

Tepe Reflow Sıcaklığı (°C)

245

Tepe Reflow Süresi (maks. sn)

30

Operating Temperaturemax

100 °C

Package Description

BGA-900

Uzunluk

31 mm

Operating Temperaturemin

-40 °C

Package Code

BGA

Seated Heightmax

2.88 mm

Package Equivalence Code

BGA900,30X30,40

Number Of Terminals

900

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Package Body Material

PLASTIC/EPOXY

Terminal Adımı

1 mm

Package Style

GRID ARRAY

REACH Uyumluluk Kodu

compliant

Rohs Code

Yes

Supply Voltagenom

0.85 V

Supply Voltagemin

0.825 V

Terminal Pozisyonu

BOTTOM

JESD-609 Kodu

e1