XCZU7EV-3FBVB900I

Specifications

Terminal Formu

BALL

HTS Kodu

8542.31.00.01

Package Description

FCBGA-900

Terminal Kaplaması

TIN SILVER COPPER

Part Life Cycle Code

Active

Tepe Reflow Sıcaklığı (°C)

245

Tepe Reflow Süresi (maks. sn)

30

Operating Temperaturemax

100 °C

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Moisture Sensitivity Levels

4

Temperature Grade

INDUSTRIAL

Genişlik

31 mm

Jesd30 Code

S-PBGA-B900

Yüzey Montaj

YES

Package Shape

SQUARE

Package Body Material

PLASTIC/EPOXY

Rohs Code

Yes

Supply Voltagenom

0.9 V

Terminal Pozisyonu

BOTTOM

JESD-609 Kodu

e1

Package Style

GRID ARRAY

REACH Uyumluluk Kodu

compliant

Terminal Adımı

1 mm

Operating Temperaturemin

-40 °C

Seated Heightmax

2.97 mm

Package Code

BGA

Uzunluk

31 mm

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Date Of Intro

2017-02-15

Number Of Terminals

900