XCZU7EV-2LFBVB900E

Specifications

Moisture Sensitivity Levels

4

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Temperature Grade

OTHER

Bus Compatibility

CAN, I2C, SPI, UART

Jesd30 Code

S-PBGA-B900

Genişlik

31 mm

Yüzey Montaj

YES

Package Shape

SQUARE

Terminal Formu

BALL

Package Description

FCBGA-900

Tepe Reflow Sıcaklığı (°C)

245

Tepe Reflow Süresi (maks. sn)

30

Operating Temperaturemax

110 °C

Terminal Kaplaması

TIN SILVER COPPER

Part Life Cycle Code

Active

Package Equivalence Code

BGA900,30X30,40

Package Code

BGA

Seated Heightmax

2.88 mm

Uzunluk

31 mm

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Number Of Terminals

900

Package Body Material

PLASTIC/EPOXY

Terminal Pozisyonu

BOTTOM

JESD-609 Kodu

e1

Rohs Code

Yes

Supply Voltagenom

0.85 V

Terminal Adımı

1 mm

Package Style

GRID ARRAY

REACH Uyumluluk Kodu

compliant