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C3 ChipZentronix

AMD

XCZU7EG-L2FBVB900E

SoC

RoHS: Compliant

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RoHS

Compliant

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Specifications

Supply Voltagemin Vsup
0.698V
Yayın Yılı
2016
Upsucsperipheral Ics Type
MICROPROCESSOR CIRCUIT
Terminal Sayısı
900
Number Of Ios
204
Jesd30 Code
R-PBGA-B900
Yüzey Montaj
YES
Paket
Tray
Temel Ürün No
XCZU7
Terminal Formu
BALL
Kılıf / Paket
900-BBGA, FCBGA
Primary Attributes
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
HTS Kodu
8542.31.00.01
Besleme Gerilimi
0.72V
Seri
Zynq® UltraScale+™ MPSoC EG
Ambalaj
Tray
RoHS Durumu
ROHS3 Compliant
Tepe Reflow Süresi (maks. sn)
NOT SPECIFIED
Tepe Reflow Sıcaklığı (°C)
NOT SPECIFIED
Tedarikçi Cihaz Paketi
900-FCBGA (31x31)
Peripherals
DMA, WDT
Speed
533MHz, 600MHz, 1.3GHz
Fabrika Tedarik Süresi
11 Weeks
Ram Size
256KB
Ürün Durumu
Active
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Parça Durumu
Active
Supply Voltagemax Vsup
0.742V
Additional Feature
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Çalışma Sıcaklığı
0°C ~ 100°C (TJ)
Terminal Pozisyonu
BOTTOM
Nem Hassasiyeti (MSL)
4 (72 Hours)
Architecture
MCU, FPGA

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