XCZU7EG-2LFBVB900E

Specifications

Uzunluk

31 mm

Package Code

BGA

Seated Heightmax

2.88 mm

Package Equivalence Code

BGA900,30X30,40

Number Of Terminals

900

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Package Body Material

PLASTIC/EPOXY

Terminal Adımı

1 mm

Package Style

GRID ARRAY

REACH Uyumluluk Kodu

compliant

Supply Voltagenom

0.85 V

Rohs Code

Yes

Terminal Pozisyonu

BOTTOM

JESD-609 Kodu

e1

Bus Compatibility

CAN, I2C, SPI, UART

Temperature Grade

OTHER

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Moisture Sensitivity Levels

4

Yüzey Montaj

YES

Package Shape

SQUARE

Genişlik

31 mm

Jesd30 Code

S-PBGA-B900

Terminal Formu

BALL

Terminal Kaplaması

TIN SILVER COPPER

Part Life Cycle Code

Active

Tepe Reflow Süresi (maks. sn)

30

Operating Temperaturemax

110 °C

Tepe Reflow Sıcaklığı (°C)

245

Package Description

FCBGA-900