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C3 ChipZentronix

AMD

XCZU7CG-L1FFVC1156I

SoC

RoHS: Compliant

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RoHS

Compliant

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Specifications

Üretici Parça No
EXS05MLC1
Minimum Cable Diameter Mm
16 mm
Supply Voltagemin Vsup
0.698V
Yayın Yılı
2016
Upsucsperipheral Ics Type
MICROPROCESSOR CIRCUIT
Number Of Ios
360
Yüzey Montaj
YES
Paket
Tray
Temel Ürün No
XCZU7
Jesd30 Code
R-PBGA-B1156
Material
Stainless Steel
Besleme Gerilimi
0.72V
Ip Rating
IP68
Primary Attributes
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
HTS Kodu
8542.31.00.01
Terminal Formu
BALL
Kılıf / Paket
1156-BBGA, FCBGA
Tepe Reflow Süresi (maks. sn)
NOT SPECIFIED
Tepe Reflow Sıcaklığı (°C)
NOT SPECIFIED
Approvals
UL
RoHS Durumu
ROHS3 Compliant
Ambalaj
Tray
Seri
Zynq® UltraScale+™ MPSoC CG
Grip Type
Double Compression Gland
Maximum Cable Diameter Mm
26 mm
Ram Size
256KB
Speed
500MHz, 1.2GHz
Peripherals
DMA, WDT
Fabrika Tedarik Süresi
11 Weeks
Tedarikçi Cihaz Paketi
1156-FCBGA (35x35)
Parça Durumu
Active
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RoHS
No
Cable Style
Round
Ürün Durumu
Active
Çalışma Sıcaklığı
-40°C ~ 100°C (TJ)
Angle
Straight
Additional Feature
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Supply Voltagemax Vsup
0.742V

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