XCZU7CG-1LFBVB900I

Specifications

Operating Temperaturemin

-40 °C

Package Code

BGA

Seated Heightmax

2.88 mm

Package Equivalence Code

BGA900,30X30,40

Uzunluk

31 mm

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Number Of Terminals

900

Package Body Material

PLASTIC/EPOXY

Rohs Code

Yes

Supply Voltagenom

0.85 V

Terminal Pozisyonu

BOTTOM

JESD-609 Kodu

e1

Package Style

GRID ARRAY

REACH Uyumluluk Kodu

compliant

Terminal Adımı

1 mm

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Moisture Sensitivity Levels

4

Temperature Grade

INDUSTRIAL

Bus Compatibility

CAN, I2C, SPI, UART

Genişlik

31 mm

Jesd30 Code

S-PBGA-B900

Package Shape

SQUARE

Yüzey Montaj

YES

Terminal Formu

BALL

Package Description

FCBGA-900

Terminal Kaplaması

TIN SILVER COPPER

Part Life Cycle Code

Active

Tepe Reflow Sıcaklığı (°C)

245

Tepe Reflow Süresi (maks. sn)

30

Operating Temperaturemax

100 °C