XCZU6CG-1SFVC784E

Specifications

Package Equivalence Code

BGA78428X28,32

Package Code

FBGA

Seated Heightmax

3.32 mm

Uzunluk

23 mm

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Number Of Terminals

784

Package Body Material

PLASTIC/EPOXY

JESD-609 Kodu

e1

Terminal Pozisyonu

BOTTOM

Supply Voltagemin

0.825 V

Supply Voltagenom

0.85 V

Rohs Code

Yes

REACH Uyumluluk Kodu

compliant

Package Style

GRID ARRAY, FINE PITCH

Terminal Adımı

0.8 mm

Moisture Sensitivity Levels

4

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Bus Compatibility

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

Temperature Grade

OTHER

Supply Voltagemax

0.876 V

Jesd30 Code

S-PBGA-B784

Genişlik

23 mm

Package Shape

SQUARE

Yüzey Montaj

YES

Terminal Formu

BALL

HTS Kodu

8542.31.00.01

Package Description

BGA-784

Tepe Reflow Süresi (maks. sn)

30

Operating Temperaturemax

100 °C

Tepe Reflow Sıcaklığı (°C)

250

Part Life Cycle Code

Active

Terminal Kaplaması

TIN SILVER COPPER