XCZU5EV-3SFVC784I

Specifications

Operating Temperaturemin

-40 °C

Package Code

FBGA

Seated Heightmax

3.32 mm

Uzunluk

23 mm

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Number Of Terminals

784

Date Of Intro

2017-02-15

Package Body Material

PLASTIC/EPOXY

JESD-609 Kodu

e1

Terminal Pozisyonu

BOTTOM

Rohs Code

Yes

Supply Voltagenom

0.9 V

Terminal Adımı

0.8 mm

REACH Uyumluluk Kodu

compliant

Package Style

GRID ARRAY, FINE PITCH

Moisture Sensitivity Levels

4

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Temperature Grade

INDUSTRIAL

Jesd30 Code

S-PBGA-B784

Genişlik

23 mm

Yüzey Montaj

YES

Package Shape

SQUARE

Terminal Formu

BALL

HTS Kodu

8542.31.00.01

Package Description

FCBGA-784

Tepe Reflow Sıcaklığı (°C)

250

Operating Temperaturemax

100 °C

Tepe Reflow Süresi (maks. sn)

30

Terminal Kaplaması

TIN SILVER COPPER

Part Life Cycle Code

Active