XCZU5EG-1LSFVC784I

Specifications

Terminal Pozisyonu

BOTTOM

Temperature Grade

INDUSTRIAL

Package Style

GRID ARRAY, FINE PITCH

Terminal Adımı

0.8 mm

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Tepe Reflow Süresi (maks. sn)

30

Number Of Terminals

784

Seated Heightmax

3.32 mm

Terminal Kaplaması

TIN SILVER COPPER

Package Code

FBGA

Operating Temperaturemin

-40 °C

Moisture Sensitivity Levels

4

Rohs Code

Yes

Operating Temperaturemax

100 °C

REACH Uyumluluk Kodu

compliant

Genişlik

23 mm

Part Life Cycle Code

Active

Terminal Formu

BALL

Package Equivalence Code

BGA784,28X28,32

Tepe Reflow Sıcaklığı (°C)

250

Package Body Material

PLASTIC/EPOXY

Package Shape

SQUARE

Jesd30 Code

S-PBGA-B784

Bus Compatibility

CAN, I2C, SPI, UART

Package Description

FCBGA-784

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

JESD-609 Kodu

e1

Supply Voltagenom

0.85 V

Uzunluk

23 mm

Yüzey Montaj

YES