XCZU5CG-2LFBVB900I

Specifications

JESD-609 Kodu

e1

Supply Voltagenom

0.85 V

Uzunluk

31 mm

Yüzey Montaj

YES

Tepe Reflow Sıcaklığı (°C)

245

Package Shape

SQUARE

Package Body Material

PLASTIC/EPOXY

Jesd30 Code

S-PBGA-B900

Bus Compatibility

CAN, I2C, SPI, UART

Package Description

FCBGA-900

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

REACH Uyumluluk Kodu

compliant

Genişlik

31 mm

Part Life Cycle Code

Active

Terminal Formu

BALL

Package Equivalence Code

BGA900,30X30,40

Rohs Code

Yes

Operating Temperaturemax

100 °C

Package Code

BGA

Operating Temperaturemin

-40 °C

Moisture Sensitivity Levels

4

Seated Heightmax

2.88 mm

Terminal Kaplaması

TIN SILVER COPPER

Terminal Adımı

1 mm

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Tepe Reflow Süresi (maks. sn)

30

Number Of Terminals

900

Terminal Pozisyonu

BOTTOM

Temperature Grade

INDUSTRIAL

Package Style

GRID ARRAY