XCZU5CG-1LSFVC784I

Specifications

JESD-609 Kodu

e1

Yüzey Montaj

YES

Uzunluk

23 mm

Supply Voltagenom

0.85 V

Tepe Reflow Sıcaklığı (°C)

250

Package Shape

SQUARE

Package Body Material

PLASTIC/EPOXY

Package Description

FCBGA-784

Bus Compatibility

CAN, I2C, SPI, UART

Jesd30 Code

S-PBGA-B784

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Genişlik

23 mm

REACH Uyumluluk Kodu

compliant

Part Life Cycle Code

Active

Package Equivalence Code

BGA784,28X28,32

Terminal Formu

BALL

Rohs Code

Yes

Operating Temperaturemax

100 °C

Moisture Sensitivity Levels

4

Operating Temperaturemin

-40 °C

Package Code

FBGA

Seated Heightmax

3.32 mm

Terminal Kaplaması

TIN SILVER COPPER

Terminal Adımı

0.8 mm

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Tepe Reflow Süresi (maks. sn)

30

Number Of Terminals

784

Terminal Pozisyonu

BOTTOM

Temperature Grade

INDUSTRIAL

Package Style

GRID ARRAY, FINE PITCH