XCZU4EV-3SFVC784I

Specifications

Seated Heightmax

3.32 mm

Terminal Kaplaması

TIN SILVER COPPER

Package Code

FBGA

Operating Temperaturemin

-40 °C

Moisture Sensitivity Levels

4

HTS Kodu

8542.31.00.01

Terminal Pozisyonu

BOTTOM

Package Style

GRID ARRAY, FINE PITCH

Temperature Grade

INDUSTRIAL

Date Of Intro

2017-02-15

Terminal Adımı

0.8 mm

Number Of Terminals

784

Tepe Reflow Süresi (maks. sn)

30

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Package Shape

SQUARE

Package Body Material

PLASTIC/EPOXY

Tepe Reflow Sıcaklığı (°C)

250

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Package Description

FCBGA-784

Jesd30 Code

S-PBGA-B784

JESD-609 Kodu

e1

Yüzey Montaj

YES

Supply Voltagenom

0.9 V

Uzunluk

23 mm

Rohs Code

Yes

Operating Temperaturemax

100 °C

Genişlik

23 mm

REACH Uyumluluk Kodu

compliant

Terminal Formu

BALL

Part Life Cycle Code

Active