XCZU4EG-2LSFVC784E

Specifications

Part Life Cycle Code

Active

Package Equivalence Code

BGA784,28X28,32

Terminal Formu

BALL

Genişlik

23 mm

REACH Uyumluluk Kodu

compliant

Operating Temperaturemax

110 °C

Rohs Code

Yes

Yüzey Montaj

YES

Uzunluk

23 mm

Supply Voltagenom

0.85 V

JESD-609 Kodu

e1

Package Description

FCBGA-784

Bus Compatibility

CAN, I2C, SPI, UART

Jesd30 Code

S-PBGA-B784

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Tepe Reflow Sıcaklığı (°C)

250

Package Body Material

PLASTIC/EPOXY

Package Shape

SQUARE

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Number Of Terminals

784

Tepe Reflow Süresi (maks. sn)

30

Terminal Adımı

0.8 mm

Temperature Grade

OTHER

Package Style

GRID ARRAY, FINE PITCH

Terminal Pozisyonu

BOTTOM

Moisture Sensitivity Levels

4

Package Code

FBGA

Terminal Kaplaması

TIN SILVER COPPER

Seated Heightmax

3.32 mm