XCZU4EG-1LSFVC784I

Specifications

Terminal Kaplaması

TIN SILVER COPPER

Seated Heightmax

3.32 mm

Moisture Sensitivity Levels

4

Operating Temperaturemin

-40 °C

Package Code

FBGA

Package Style

GRID ARRAY, FINE PITCH

Temperature Grade

INDUSTRIAL

Terminal Pozisyonu

BOTTOM

Tepe Reflow Süresi (maks. sn)

30

Number Of Terminals

784

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Terminal Adımı

0.8 mm

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Jesd30 Code

S-PBGA-B784

Package Description

FCBGA-784

Bus Compatibility

CAN, I2C, SPI, UART

Package Shape

SQUARE

Package Body Material

PLASTIC/EPOXY

Tepe Reflow Sıcaklığı (°C)

250

Uzunluk

23 mm

Supply Voltagenom

0.85 V

Yüzey Montaj

YES

JESD-609 Kodu

e1

Operating Temperaturemax

100 °C

Rohs Code

Yes

Terminal Formu

BALL

Package Equivalence Code

BGA784,28X28,32

Part Life Cycle Code

Active

REACH Uyumluluk Kodu

compliant

Genişlik

23 mm