XCZU4CG-2LFBVB900I

Specifications

Tepe Reflow Süresi (maks. sn)

30

Number Of Terminals

900

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Terminal Adımı

1 mm

Package Style

GRID ARRAY

Temperature Grade

INDUSTRIAL

Terminal Pozisyonu

BOTTOM

Moisture Sensitivity Levels

4

Package Code

BGA

Operating Temperaturemin

-40 °C

Terminal Kaplaması

TIN SILVER COPPER

Seated Heightmax

2.88 mm

Terminal Formu

BALL

Package Equivalence Code

BGA900,30X30,40

Part Life Cycle Code

Active

REACH Uyumluluk Kodu

compliant

Genişlik

31 mm

Operating Temperaturemax

100 °C

Rohs Code

Yes

Uzunluk

31 mm

Supply Voltagenom

0.85 V

Yüzey Montaj

YES

JESD-609 Kodu

e1

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Jesd30 Code

S-PBGA-B900

Bus Compatibility

CAN, I2C, SPI, UART

Package Description

FCBGA-900

Package Body Material

PLASTIC/EPOXY

Package Shape

SQUARE

Tepe Reflow Sıcaklığı (°C)

245