XCZU4CG-2LFBVB900E

Specifications

Genişlik

31 mm

REACH Uyumluluk Kodu

compliant

Part Life Cycle Code

Active

Package Equivalence Code

BGA900,30X30,40

Terminal Formu

BALL

Rohs Code

Yes

Operating Temperaturemax

110 °C

JESD-609 Kodu

e1

Yüzey Montaj

YES

Supply Voltagenom

0.85 V

Uzunluk

31 mm

Tepe Reflow Sıcaklığı (°C)

245

Package Body Material

PLASTIC/EPOXY

Package Shape

SQUARE

Bus Compatibility

CAN, I2C, SPI, UART

Package Description

FCBGA-900

Jesd30 Code

S-PBGA-B900

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Terminal Adımı

1 mm

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Tepe Reflow Süresi (maks. sn)

30

Number Of Terminals

900

Terminal Pozisyonu

BOTTOM

Temperature Grade

OTHER

Package Style

GRID ARRAY

Package Code

BGA

Moisture Sensitivity Levels

4

Seated Heightmax

2.88 mm

Terminal Kaplaması

TIN SILVER COPPER