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C3 ChipZentronix

AMD

XCZU3EG-2SFVA625I

SoC

RoHS: Compliant

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RoHS

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Specifications

Number Of Ios
180
Yayın Yılı
2016
Seri
Zynq® UltraScale+™ MPSoC EG
RoHS Durumu
ROHS3 Compliant
Kılıf / Paket
625-BFBGA, FCBGA
Terminal Formu
BALL
Tepe Reflow Sıcaklığı (°C)
NOT SPECIFIED
Besleme Gerilimi
0.85V
Terminal Sayısı
625
RoHS
Non-Compliant
Jesd30 Code
R-PBGA-B625
Supply Voltagemax Vsup
0.876V
Supply Voltagemin Vsup
0.825V
Temel Ürün No
XCZU3
Ürün Durumu
Active
Yüzey Montaj
YES
Primary Attributes
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
HTS Kodu
8542.31.00.01
Terminal Pozisyonu
BOTTOM
Ambalaj
Tray
Nem Hassasiyeti (MSL)
4 (72 Hours)
Paket
Tray
Upsucsperipheral Ics Type
MICROPROCESSOR CIRCUIT
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Tepe Reflow Süresi (maks. sn)
NOT SPECIFIED
Peripherals
DMA, WDT
Architecture
MCU, FPGA
Speed
533MHz, 600MHz, 1.3GHz
Ram Size
256KB
Fabrika Tedarik Süresi
11 Weeks
Tedarikçi Cihaz Paketi
625-FCBGA (21x21)
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Çalışma Sıcaklığı
-40°C ~ 100°C (TJ)
Parça Durumu
Active

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