XCZU3EG-2LSFVC784E

Specifications

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Tepe Reflow Süresi (maks. sn)

30

Number Of Terminals

784

Terminal Adımı

0.8 mm

Temperature Grade

OTHER

Package Style

GRID ARRAY, FINE PITCH

Terminal Pozisyonu

BOTTOM

Package Code

FBGA

Moisture Sensitivity Levels

4

Terminal Kaplaması

TIN SILVER COPPER

Seated Heightmax

3.32 mm

Part Life Cycle Code

Active

Terminal Formu

BALL

Package Equivalence Code

BGA784,28X28,32

REACH Uyumluluk Kodu

compliant

Genişlik

23 mm

Operating Temperaturemax

110 °C

Rohs Code

Yes

Supply Voltagenom

0.85 V

Uzunluk

23 mm

Yüzey Montaj

YES

JESD-609 Kodu

e1

Jesd30 Code

S-PBGA-B784

Bus Compatibility

CAN, I2C, SPI, UART

Package Description

FCBGA-784

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Tepe Reflow Sıcaklığı (°C)

250

Package Body Material

PLASTIC/EPOXY

Package Shape

SQUARE