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C3 ChipZentronix

AMD

XCZU3EG-2LSFVA625E

Application Specific Microcontrollers

RoHS: Compliant

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Specifications

Ihs Manufacturer
ADVANCED MICRO DEVICES INC
Bus Compatibility
CAN, I2C, SPI, UART
Package Description
FCBGA-625
Jesd30 Code
S-PBGA-B625
Package Body Material
PLASTIC/EPOXY
Package Shape
SQUARE
Yüzey Montaj
YES
Supply Voltagenom
0.85 V
Uzunluk
21 mm
JESD-609 Kodu
e1
Operating Temperaturemax
110 °C
Rohs Code
Yes
Package Equivalence Code
BGA625,25X25,32
Terminal Formu
BALL
Part Life Cycle Code
Active
Genişlik
21 mm
REACH Uyumluluk Kodu
compliant
Terminal Kaplaması
TIN SILVER COPPER
Seated Heightmax
3.43 mm
Package Code
FBGA
Moisture Sensitivity Levels
4
Package Style
GRID ARRAY, FINE PITCH
Temperature Grade
OTHER
Terminal Pozisyonu
BOTTOM
Number Of Terminals
625
Upsucsperipheral Ics Type
PROGRAMMABLE SoC
Terminal Adımı
0.8 mm

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