Volume pricing
- 1+ pcs$525.61
- 10+ pcs$495.86
- 100+ pcs$467.79
- 500+ pcs$441.31
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Number Of Ios
- 180
- Terminal Sayısı
- 625
- Upsucsperipheral Ics Type
- MICROPROCESSOR CIRCUIT
- Yayın Yılı
- 2016
- Supply Voltagemin Vsup
- 0.698V
- Jesd30 Code
- R-PBGA-B625
- Temel Ürün No
- XCZU3
- Paket
- Tray
- Yüzey Montaj
- YES
- Kılıf / Paket
- 625-BFBGA, FCBGA
- Terminal Formu
- BALL
- HTS Kodu
- 8542.31.00.01
- Primary Attributes
- Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
- Besleme Gerilimi
- 0.72V
- Ambalaj
- Tray
- Seri
- Zynq® UltraScale+™ MPSoC CG
- RoHS Durumu
- ROHS3 Compliant
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Tedarikçi Cihaz Paketi
- 625-FCBGA (21x21)
- Peripherals
- DMA, WDT
- Speed
- 500MHz, 1.2GHz
- Fabrika Tedarik Süresi
- 11 Weeks
- Ram Size
- 256KB
- Ürün Durumu
- Active
- Parça Durumu
- Active
- Core Processor
- Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Supply Voltagemax Vsup
- 0.742V
- Connectivity
- CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Additional Feature
- ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
- Çalışma Sıcaklığı
- -40°C ~ 100°C (TJ)
- Terminal Pozisyonu
- BOTTOM
- Architecture
- MCU, FPGA
- Nem Hassasiyeti (MSL)
- 4 (72 Hours)