XCZU3CG-2LSFVC784I

Specifications

Jesd30 Code

S-PBGA-B784

Genişlik

23 mm

Yüzey Montaj

YES

Package Shape

SQUARE

Moisture Sensitivity Levels

4

Upsucsperipheral Ics Type

PROGRAMMABLE SoC

Bus Compatibility

CAN, I2C, SPI, UART

Temperature Grade

INDUSTRIAL

Package Description

FCBGA-784

Operating Temperaturemax

100 °C

Tepe Reflow Süresi (maks. sn)

30

Tepe Reflow Sıcaklığı (°C)

250

Terminal Kaplaması

TIN SILVER COPPER

Part Life Cycle Code

Active

Terminal Formu

BALL

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Number Of Terminals

784

Package Equivalence Code

BGA784,28X28,32

Package Code

FBGA

Seated Heightmax

3.32 mm

Operating Temperaturemin

-40 °C

Uzunluk

23 mm

JESD-609 Kodu

e1

Terminal Pozisyonu

BOTTOM

Supply Voltagenom

0.85 V

Rohs Code

Yes

Terminal Adımı

0.8 mm

REACH Uyumluluk Kodu

compliant

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY